HTCC / LTCC SOURCING

HTCC / LTCC Drawing Review and Sourcing

HTCC and LTCC ceramic substrate requirements are assessed against drawings, material, structure, metallization, and application needs. Related ceramic products are reviewed by project.

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HTCC multilayer ceramic packages and LTCC high-frequency multilayer substrate range

Specification Review Points

HTCC / LTCC and ceramic package sourcing usually requires material, structure, metallization, and application review. These fields are useful for the first RFQ.

Material systemLayer / structureDimensions and tolerancesMetallizationSurface finishQuantity and lead time

Ceramic images on this page illustrate product structures; they do not represent ETECKSPACE inventory, offered part numbers, or a specific supply source.

HTCC multilayer ceramic package structures

HTCC Ceramic Substrates

High-temperature co-fired alumina substrates, metallized substrates, and high-reliability package carriers.

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LTCC multilayer ceramic substrate structures

LTCC Multilayer Substrates

Low-temperature co-fired ceramic substrates for RF, communication, sensor, and miniaturized module applications.

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Related Ceramics Assessed by Project

Ceramic packages, thick-film, alumina / AlN substrates, and other drawing-based requirements are assessed after material, specification, and quantity information is available.

Clear requirements make a faster RFQ

Part number or reference manufacturer model
Drawing, sample photos, or key dimensions
Material, layer, metallization, and surface finish requirements
Quantity, target lead time, and application
Whether alternative material or structure is acceptable