HTCC

HTCC Ceramic Substrates and Multilayer Packages

Drawing review and sourcing coordination for high-temperature co-fired ceramic substrates, multilayer cavity packages, and metallized structures used in high-reliability electronics.

Submit a Drawing Review Quality Process

High-temperature co-fired system
Multilayer cavities and metallization
Drawing-led project review

TECHNICAL DEFINITION

What is HTCC ceramic technology?

HTCC co-fires ceramic green tape, multilayer conductors, vias, and metallized structures at high temperature. It is commonly considered for electronic structures requiring heat resistance, hermetic packaging, multilayer interconnection, or high reliability. Final material and performance requirements must follow the project drawing and process data.

HTCC alumina multilayer cavity package with reverse land grid and exposed laminated side structure — Illustrative product structure; not inventory, an offered part number, or a specific supply source.

Drawing review and sourcing coordination

Materials and Process Review

HTCC commonly uses alumina ceramic systems and high-temperature co-fired metallization. RFQ review should confirm ceramic material, layer count, cavities and vias, conductor system, plating, brazing, and lead structure against the customer drawing or sample.

2D / 3D drawing or reference sample
Ceramic material, layer count, and structure
Dimensions, tolerances, vias, and cavity requirements

Submit your drawing and requirements

Typical Application Areas

Hermetic ceramic packages and chip carriers
Sensor, optoelectronic, and MEMS packages
High-temperature and high-reliability industrial electronics
Electronic modules requiring multilayer routing or cavities

Quality and Documentation Checks

Checks can cover appearance, cracks and chips, dimensions and tolerances, metallized areas, plating, continuity, packaging, and batch documentation. Sample or third-party test records can be coordinated by project requirement.

View the quality review process

Recommended HTCC RFQ Information

2D / 3D drawing or reference sample
Ceramic material, layer count, and structure
Dimensions, tolerances, vias, and cavity requirements
Metallization, plating, and lead method
Sample quantity, production demand, and target lead time

Prepare Drawing Inquiry